Defining Stack-Ups for Flex and Rigid-Flex Circuit Boards
The question of complexity with rigid-flex and flexible circuits is never an easy one. Just in the concept alone, rigid-flex and flexible PCB designs pose challenges, whether it’s due to the thin nature of the flexible areas, the larger process to manufacture, or the different materials. But to add to this complexity, the process and difficulty can change due to a variety of factors.
Factors such as layer counts, air gaps, asymmetrical constructions, ZIF connectors, shielding, blind and buried vias, and many other things can factor into a stack-up, turning what was already a difficult construction into something many board manufacturers might not even consider building.
While these may all seem overwhelming, tackling all of these one at a time makes them that much more manageable, allowing us to build what was a complex board one piece at a time.
In this webinar, we cover stack-ups, ranging from the most basic 1-layer flexible PCB design, all the way up to the more daunting 14-layer rigid-flex PCB stack-up with airgaps, showcasing the various items that can go into a stack-up, and what can be made possible within the world of flexible circuits.
Check Out the Full Q&A
We have compiled all the questions submitted at the conclusion of this webinar into a readable format available on our blog.
Webinar Agenda:
- Overview of stack-up materials and their importance
- Examples of flex PCB stack-ups
- When adding layer makes it no longer flexible
- Overview of bend radius
- Examples of rigid-flex PCB stack-ups
- Flex to rigid transition zones
- Incorporating shielding films and stiffeners in your stack-up
- Air gap constructions
- How your stack-up affects the overall cost