The environments in which cable assemblies and the electronics associated with the transmission of the signal through those assemblies is becoming harsher. This in part is being caused by the realization that electronics can be used in locations that in the past were considered beyond the realm of what the electronics and terminations could withstand.
Advances in compounds and termination methods have allowed this expansion to happen, but technical expertise in the area of molding has taken this advancement to the next level.
In this webinar we investigate what possibilities exist for electronics in harsh environments as well as the manufacturing techniques used to allow this happen.