Wave Soldering Defects


Lifted Pads on a Printed Circuit Board

Lifted pads are rarely seen on plated through hole boards but can occur on single-sided boards during assembly. The example in Figure 1 occurred directly after wave soldering when the assembly was being handled. The adhesion of the copper foil decreases as the surface heats up so directly after soldering the copper adhesion can be low. Any handling or force applied to the components can cause lifting of the pads. Care needs to be taken when lifting boards from the conveyor or out of pallets as often large components are often used by operators as handles.



Figure 1: This lifted pad occurred during handling, right after wave soldering
Figure 1: This lifted pad occurred during handling, right after wave soldering.


For more information see our blog post titled "What Causes Pad Lifting On Printed Circuit Boards?".

Celebrating 70 Years of Manufacturing Excellence
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Over the past 70 years, the electronics manufacturing industry has changed dramatically as the industry continues to adapt to evolving demands and technology. Epec is at the forefront of innovation, with the expertise and agility to move at the speed of today’s businesses. At Epec, the customer comes first, and everything we do must be put through that filter. Whether it is developing e-commerce platforms to make it easier to work with us or creating a new product introduction (NPI) process that helps our customers get to market faster, we must focus on building the new. By doing that every day, and by always making the customer our top priority, we plan on being here for another 70 years and then some.

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