Printed Circuit Board Reliability Test

Epec manufactured circuit boards go through a series of extensive tests and inspections at each step of the manufacturing process to assure the products we ship meets or exceed your specifications. Below are some of our circuit board test methods.

PCB Lamination

Test Item	Test Method/Equipment	Criteria	Capability
Glass Transition Temperature	D.S.C T.M.A D.M.A	FR- 4 Tetra>130°(D.S.C) FR- 4 NP170>175°(D.M.A) FR- 406>165°(D.S.C)	>132° >176° >168°
Peel Strength	IPC-TM-650	Trace to Laminate>9 lb/in (Normal Tg Material) Trace to Laminate 6 lb/in (High Tg Material) Layer to Layer>4 lb/in	>10 lb >6 lb >6 lb

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PCB Copper Plating

Test Item	Test Method/Equipment	Criteria	Capability
Elongation Test	TPC-TM-650	>6%	>10%
Tensile Strength	TPC-TM-650	>25kg/mm	>30kgf

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PCB Solderability

Test Item	Test Method/Equipment	Criteria	Capability
PTH SMD / BGA Pad	1. Solder Pot Floating: 245°,4sec 2. Wetting Balance	No Dewetting	Pass

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PCB Hole Wall Quality

Test Item	Test Method/Equipment	Criteria	Capability
Temperature Cycling	125°,15Min -55°,15Min	1. Hole Wall Resistance <20% change after 1000 cycles 2. Hole Wall Quality	1. <20 2. No Crack
Thermal Shock	125°,5min -55°,5min	1. Hole Wall Resistance<10% change after 100 cycle 2. Hole wall Quality	1. <10% 2. No Crack
Thermal Stress	288°,10sec, Solder Float	No Delamination No Hole Wall Detect	Pass

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PCB Electrical Test

Test Item	Test Method/Equipment	Criteria	Capability
High Pot. Test	1000 Volts,1minute	<1mA Leakage	Pass

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PCB Environment Test

Test Item	Test Method/Equipment	Criteria	Capability
Water Absorption Test (for BGA)	120°,2hrs,after 24hrs	Wright Increase <0.24% after 24hrs test	<0.2%

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PCB Cleanliness Test

Test Item	Test Method/Equipment	Criteria	Capability
Surface Insulation Resistance	Pre Condition:23°, 50% RH,3hr Test Condition:35°, 85% RH,24hr	Insulation Resistance After Black Oxide>10G Ω After O/L Etch>10G Ω After HASL>3G Ω	>10G Ω >10G Ω >4G Ω
Solvent Extract Conductivity	Omega Meter 600 SMD 15min Omega Meter 500 SMD 15min (for BGA) After Black Oxide, O/L Etch, Finish Board	1. <6.4ugNacl/in² 2. <2.4ugNacl/in² (for BGA substrate)	1. Avg:<4 2. Avg:<2.0
High Humidity	50°,95%/RH, 7days,100V Bias	Resistance>1G Ω	Pass
I.C.T	I.C.T	1. CI‾ <3ug/in² 2. Br‾ <3ug/in² 3. SO4²- <10ug/in²	1. Avg:<2.8 2. Avg:<2 3. Avg:<8

See our blog post titled PCB Cleanliness Attention to Details for more information.

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Experience the PCB Difference

Epec circuit boards outperform with rigorous testing at every manufacturing step. Trust our unmatched advanced PCB capabilities.

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