Printed Circuit Board Reliability Test

Epec manufactured circuit boards go through a series of extensive tests and inspections at each step of the manufacturing process to assure the products we ship meets or exceed your specifications. Below are some of our circuit board test methods.


PCB Lamination

Test Item Test Method/Equipment Criteria Capability
Glass Transition

Temperature
D.S.C
T.M.A
D.M.A
FR- 4 Tetra>130°(D.S.C)
FR- 4 NP170>175°(D.M.A)
FR- 406>165°(D.S.C)
>132°
>176°
>168°
Peel Strength IPC-TM-650 Trace to Laminate>9 lb/in (Normal Tg Material)
Trace to Laminate 6 lb/in (High Tg Material)
Layer to Layer>4 lb/in
>10 lb
>6 lb
>6 lb


PCB Copper Plating

Test Item Test Method/Equipment Criteria Capability
Elongation Test TPC-TM-650 >6% >10%
Tensile Strength TPC-TM-650 >25kg/mm >30kgf


PCB Solderability

Test Item Test Method/Equipment Criteria Capability
PTH


SMD / BGA Pad
1. Solder Pot Floating:
245°,4sec

2. Wetting Balance
No Dewetting Pass


PCB Hole Wall Quality

Test Item Test Method/Equipment Criteria Capability
Temperature


Cycling
125°,15Min


-55°,15Min
1. Hole Wall Resistance <20%
change after 1000 cycles

2. Hole Wall Quality
1. <20


2. No Crack
Thermal


Shock
125°,5min


-55°,5min
1. Hole Wall Resistance<10%
change after 100 cycle

2. Hole wall Quality
1. <10%


2. No Crack
Thermal Stress 288°,10sec,
Solder Float
No Delamination
No Hole Wall Detect
Pass


PCB Electrical Test

Test Item Test Method/Equipment Criteria Capability
High Pot. Test 1000 Volts,1minute <1mA Leakage Pass


PCB Environment Test

Test Item Test Method/Equipment Criteria Capability
Water Absorption
Test (for BGA)
120°,2hrs,after 24hrs Wright Increase <0.24%
after 24hrs test
<0.2%


PCB Cleanliness Test

Test Item Test Method/Equipment Criteria Capability
Surface

Insulation

Resistance
Pre Condition:23°,
50% RH,3hr

Test Condition:35°,
85% RH,24hr
Insulation Resistance
After Black Oxide>10G Ω
After O/L Etch>10G Ω
After HASL>3G Ω
>10G Ω
>10G Ω
>4G Ω
Solvent

Extract

Conductivity
Omega Meter 600
SMD 15min

Omega Meter 500
SMD 15min (for BGA)

After Black Oxide,
O/L Etch, Finish Board
1. <6.4ugNacl/in²

2. <2.4ugNacl/in²
(for BGA substrate)
1. Avg:<4

2. Avg:<2.0
High Humidity 50°,95%/RH,
7days,100V Bias
Resistance>1G Ω Pass
I.C.T I.C.T 1. CI‾ <3ug/in²
2. Br‾ <3ug/in²
3. SO4²- <10ug/in²
1. Avg:<2.8
2. Avg:<2
3. Avg:<8


See our blog post titled PCB Cleanliness Attention to Details for more information.

Celebrating 70 Years of Manufacturing Excellence
America's Oldest. A History of Innovation.

Over the past 70 years, the electronics manufacturing industry has changed dramatically as the industry continues to adapt to evolving demands and technology. Epec is at the forefront of innovation, with the expertise and agility to move at the speed of today’s businesses. At Epec, the customer comes first, and everything we do must be put through that filter. Whether it is developing e-commerce platforms to make it easier to work with us or creating a new product introduction (NPI) process that helps our customers get to market faster, we must focus on building the new. By doing that every day, and by always making the customer our top priority, we plan on being here for another 70 years and then some.

Learn more about our 70 year story →





Celebrating 70 Years - Epec Engineered Technologies