Circuit Boards Specifications
Standard | Advanced | |
---|---|---|
Annular Ring | ||
Internal Minimum Pad Size | .014" larger than finished hole size | .012" larger than finished hole size w/tear drop. Half-ounce ONLY |
External Minimum Pad Size | .014" larger than finished hole size | .014" larger than finished hole size w/tear drop. Half-ounce ONLY |
Increase pad size accordingly for annular ring requirements greater than .001" | ||
Holes requiring greater than .001" copper (i.e. 2oz Base plated to 4oz Finish) require and additional .004 pad diameter. | ||
Plane Layer Clearance | ||
PTH & NPTH Hole Clearance to Plane | .030" larger than finished hole size | .020" larger than finished hole size (.10" per side over FHS) |
PTH & NPTH Hole to Inner Layer Trace | .015" Spacing | .010" Spacing (edge-to-edge) |
Line Width and Space | ||
Inner Layer Line width on H ounce copper | Minimum -.004" | Minimum - .004" |
Inner Layer Line width on 1 ounce copper | Standard-.005" | Minimum-.004" Half-ounce ONLY |
Inner Layer Line width on 2 ounce copper | Minimum -.008" | Minimum -.008" |
Inner Layer Line width on 3 ounce base copper or greater | Minimum -.012" | Minimum -.012" |
Outer Layer Line width on H ounce base copper | Minimum-.004" | Minimum-.004" |
Outer Layer Line width on 1 ounce base copper | Minimum -.005" | Minimum - .004" Half-ounce ONLY |
Outer Layer Line width on 2 ounce copper | Minimum -.008" | Minimum -.008" |
Outer Layer Line width on 3 ounce base copper or greater | Minimum -.012" | Minimum -.012" |
Inner layer Feature to Feature on 1 ounce or less base copper | Minimum -.005" | Minimum - .004" Half-ounce ONLY |
Inner layer Feature to Feature on 2 ounce Base Copper | Minimum -.008" | Minimum -.008" |
Inner layer Feature to Feature on 3 ounce copper or greater | Minimum -.012" | Minimum -.012" |
Outer layer Feature to Feature on 1 ounce or less base copper | Minimum -.005" | Minimum - .004" Half-ounce ONLY |
Outer layer Feature to Feature on 2 ounce Base Copper | Minimum -.008" | Minimum -.008" |
Outer layer Feature to Feature on 3 ounce copper or greater | Minimum -.012" | Minimum -.012" |
Trace to Plane Spacing | Minimum -.008" | Minimum -.008" |
Feature to Board Edge *does not include tabs | Minimum -.010" | Minimum -.008" |
Feature to Score Edge | Minimum -.020" | Minimum -.015" |
Solder Mask | ||
LPI Conductor Overlap | .015" Larger Than Feature Size | .010" Larger Than Feature Size |
LPI Mask Clearance | .015" Minimum | .013" Minimum |
LPI Mask Web | .005" Minimum | .005" Minimum |
Less than 4 mil web between component pins may result in loss of mask between SMT pads. | Decrease clearance to 5 mil, then web to 3.5mil, then clearance to 4 mil, etc. | |
Silkscreen | ||
Silk Screen Ink | .008" minimum aperture | .006" minimum aperture |
Copper Features (ETCHED TEXT) | .010" minimum aperture | .010" minimum aperture |
Font Height | .065" minimum height | .045" minimum height |
If the specifications of a board design fall into the advanced category it may be subject to additional charges.