Wave Soldering Defects


Joint Contamination on a Printed Circuit Board

The top of the plated through hole in Figure 1 has been contaminated during the soldering operation. The temperature has caused the coating on the resistor network to soften and has contaminated the board surface. During pre heat the top board temperature would normally be 100-110°C and may well reach over 190°C when contacting the wave. The component should not have caused this problem if normal process conditions are maintained. The component should be reassessed for process compatibility.



Figure 1: The lead-to-hole ratio here was excessive
Figure 1: The lead-to-hole ratio here was excessive.

Celebrating 70 Years of Manufacturing Excellence
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Over the past 70 years, the electronics manufacturing industry has changed dramatically as the industry continues to adapt to evolving demands and technology. Epec is at the forefront of innovation, with the expertise and agility to move at the speed of today’s businesses. At Epec, the customer comes first, and everything we do must be put through that filter. Whether it is developing e-commerce platforms to make it easier to work with us or creating a new product introduction (NPI) process that helps our customers get to market faster, we must focus on building the new. By doing that every day, and by always making the customer our top priority, we plan on being here for another 70 years and then some.

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Celebrating 70 Years - Epec Engineered Technologies