Wave Soldering Defects

Bulbous Joint / Excess Fillet on a Printed Circuit Board

A solder joint on chip components that is over the height of the part with a convex meniscus is referred to as bulbous or excess fillet. It is caused during separation of the board from the solder wave and is more common in nitrogen soldering.

Figure 1: Bulbous Joint
Figure 1: Bulbous Joint

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Over the past 70 years, the electronics manufacturing industry has changed dramatically as the industry continues to adapt to evolving demands and technology. Epec is at the forefront of innovation, with the expertise and agility to move at the speed of today’s businesses. At Epec, the customer comes first, and everything we do must be put through that filter. Whether it is developing e-commerce platforms to make it easier to work with us or creating a new product introduction (NPI) process that helps our customers get to market faster, we must focus on building the new. By doing that every day, and by always making the customer our top priority, we plan on being here for another 70 years and then some.

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