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Here you will find both standard and advanced specifications for flex and rigid-flex circuit boards including minimum hole sizes and maximum layer counts.

Flexible PCB Specifications

Item	Standard	Advanced
Min. Finished Board Thickness	0.07mm	0.062mm
Max. Board Size	500mm x 850mm	500mm x l000mm
Min. Laser Drilled Hole Size	0.1mm	0.05mm
Min. Mechanical Drilled Hole Size	0.1mm	0.1mm
Min. Trace Width/Spacing	0.05mm/0.05mm	0.04mm/0.04mm
Min. Annular Ring of Single/Double-side Flex PCB	0.1mm	0.075mm
Min. Inner Layer Annular Ring of Multi-layer Board	0.125mm	0.125mm
Min. Outer Layer Annular Ring of Multi-layer Board	0.1mm	0.1mm
Min Coverlay Bridge	0.15mm	0.1mm
Min. Soldermask Opening	0.3mm	0.2mm
Min. Coverlay Opening	0.4mm x 0.4mm	0.35mm x 0.35mm
Min. Single-ended Impedance Tolerance	±10%	±10%
Min. Differential Impedance Tolerance	±10%	±10%
Coverlay Registration
Manual Alignment	0.2mm	0.1mm
General Fixture	0.1mm
Precise Fixture	0.05mm
Max. Layer Count	8L	10L
Material Type	Kapton, PI
Material Brand	Shengyi, Taiflex, Thinflex, ITEQ, Allstar, Panasonic, DuPont, JiuJiang
Stiffener Material Type	FR4, PI, PET, Steel, Al, Adhesive Tape, Nylon
Coverlay Thickness	12.5um/25um/50um
Surface Finish	ENIG, ENEPIG, OSP, Gold Plating, Gold Plating+ENIG, Gold Plating+OSP, Immersion Silver, Immersion Tin, Plating Tin

Rigid-Flex PCB Specifications

Item	Standard	Advanced
Max Lay Count	16L	20L
Max Finished Thickness	2.8mm	3.2mm
Max Board Size	500mm x 500mm	500mm x 630mm
Min. Laser Drilled Hole Size	0.15mm	0.1mm
Min. Mechanical Drilled Hole Size	0.2mm	0.15mm
Max Mechanical Through Hole Aspect Ratio	10:1	13:1
Min. Inner Layer Trace Width/Spacing	0.075mm/0.075mm	0.05mm/0.05mm
Min. Outer Layer Trace Width/Spacing	0.1mm/0.1mm	0.07Smm/0.075mm
Soldermask Registration	0.05mm	0.038mm
Min. Soldermask Bridge	0.1mm	0.08mm
Min. BGA Pitch	0.5mm	0.5mm
Min. Single-ended Impedance Tolerance	±10%	±10%
Min. Differential Impedance Tolerance	±10%	±10%
Base Material	General Tg, Middle Tg, High Tg, Halogen Free, Low Dk, Low Loss, High CTI, PTFE
Material	Shenqyi, ITEQ, Rogers
Surface Finish	ENIG, ENEPIG, OSP, Gold Plating, Gold Plating+ENIG, Gold Plating+OSP, Immersion Silver, Immersion Tin, Plating Tin

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