Flex & Rigid-Flex PCB Data Requirements and Fabrication Instructions

Below you will find the minimum data information requirements needed to place your flex or rigid-flex circuit board order. The purpose of this webpage is to describe the minimum data and information required to generate the tooling for your order.

The minimum required data and information set can be broken down into the two categories: Data Requirements and Fabrication Instructions.

At a Glance: Data Requirements and Fabrication Instructions

• Understanding and providing complete flex and rigid-flex PCB manufacturing data helps prevent delays, engineering questions, and production issues before fabrication begins.
• Required documentation includes manufacturing data files, drill files, stack-up details, fabrication requirements, bend specifications, material selections, and critical tolerances.
• Comprehensive fabrication instructions enable accurate tooling, material selection, process control, and successful production of reliable flex and rigid-flex circuit boards.

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Flex & Rigid-Flex Data Requirements

Date set consists of the traditional data package which must include the following:

Gerber Data in the following formats:

• 274D including separate aperture list with all apertures defined
• 274X - Preferred
• Gerber files with aperture lists
• DXF can be used requires an approval prior to production
• ODB++ format

See our blog post on rigid-flex PCB gerber layout requirements for more information.

Drill Data in the following formats:

• Excellon 1
• Excellon 2

Also acceptable is ODB++ data. ODB++ will be supplied as a single file, usually with the extension of .tgz. ODB++ contains all the required board and drill information.

* Note: Any other data formats need to be reviewed and approved by Epec Engineering before the order can be placed.

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Flex & Rigid-Flex Fabrication Instructions

The fabrication instructions should contain all relevant information required to tool and build the part including:

• Material Stackup: Defining all materials, copper weights, Coverlay/Soldermask(s), and finished thickness requirements with tolerance(s)
• IPC 6013 Manufacturing Class 2 or 3 (Class 1 not available)
• Hole sizes with tolerances, and plating information
• Board outline detail with all required dimensions and tolerances
• Hole or feature to edge dimensions
• Surface finish requirements
• Silkscreen requirements
• Min. Bend Radius requirement(s)
• ZIF Connector make(s) & part number(s) that the design connects to (if utilized)
• Technical contact information
• Any additional requirements (i.e. impedance control, plugged vias, stiffeners, PSA etc.)

Fabrication instructions may be supplied in the following formats:

• Fabrication Drawing formats:
  • Adobe Acrobat (.pdf)
  • Gerber
  • RS274X
  • HPGL
  • AutoCAD (.DWG or .DXF)
  • Graphic file (.JPG, .GIF, .TIF, etc.)
  • ODB++
  • Array configurations – tab or scored preference
• Notes, read me files, and/or customer specification

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Frequently Asked Questions

Quick Links

• What manufacturing data is required to order a flex or rigid-flex PCB?
• Why is a detailed stack-up important for flex and rigid-flex PCBs?
• What fabrication instructions should be included with the design package?
• Why are bend radius requirements important in flex and rigid-flex circuit boards?
• What additional information can help streamline production?

What manufacturing data is required to order a flex or rigid-flex PCB?

At a minimum, a complete data package should include Gerber files and drill data needed to generate manufacturing tooling. Accepted formats include RS-274D with aperture lists, RS-274X, Gerber files with aperture lists, Excellon drill files, and ODB++ data. Providing complete and accurate manufacturing files helps ensure the design can move quickly into tooling and production while minimizing engineering questions and potential delays.

Why is a detailed stack-up important for flex and rigid-flex PCBs?

The stack-up defines the materials, copper weights, coverlay or soldermask construction, layer arrangement, finished thickness requirements, and manufacturing tolerances. These details directly affect electrical performance, mechanical flexibility, reliability, and manufacturability. Because flex and rigid-flex designs often contain both rigid and flexible sections, a properly defined stack-up is critical to ensuring the finished product performs as intended throughout its service life.

What fabrication instructions should be included with the design package?

Fabrication documentation should include information such as board outline dimensions, hole sizes and tolerances, plating requirements, surface finish specifications, silkscreen details, minimum bend radius requirements, stiffener requirements, impedance control requirements, ZIF connector information, and any special manufacturing instructions. The more complete the documentation, the more efficiently the design can be reviewed, tooled, and manufactured.

Why are bend radius requirements important in flex and rigid-flex circuit boards?

Bend radius requirements play a major role in the long-term reliability of flexible circuits. If a circuit is bent tighter than the design allows, stress can be introduced into conductors, coverlay materials, and plated features. Clearly defining minimum bend radius requirements during fabrication helps ensure the circuit is designed and manufactured to withstand the intended installation and operating conditions without premature failure.

What additional information can help streamline production?

Providing array preferences, customer specifications, technical contact information, impedance requirements, stiffener details, pressure-sensitive adhesive (PSA) requirements, and assembly interface information can accelerate engineering review and production readiness. Comprehensive documentation reduces interpretation errors, shortens clarification cycles, and helps ensure the final flex or rigid-flex PCB meets both manufacturing and functional requirements on the first build.

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Not Sure What Data Requirements Are Needed?

Ensure a smooth order process by meeting our minimum data requirements for flex and rigid-flex circuit boards. Submit your info today for hassle-free production.

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