Thermal Clad & Metal Backed Printed Circuit Boards
Epec offers thermal clad and metal printed circuit boards with a full selection of high performance or low cost materials from leading suppliers around the world. Thermal clad PCB’s are a dielectric metal base with a bonded copper circuit layer. This creates superior heat transfer to help cool components while eliminating problems associated with managing fragile ceramics.
With a wide range of electrical and thermally conductive interface pads, thermally conductive gap fillers, thermal phase change materials and thermally conductive electrically insulating materials, we can manufacture thermal clad & metal backed printed circuit boards that exceed all of our customers' expectations.
Thermal clad is a unique layered system comprised of the follow layers
Printed circuit foil with thickness of 1oz to 5 oz.
Many different options which offer electrical isolation with minimum thermal resistance. Also used to bond the circuit layer and base material together. Each specific dielectric has its own UL recognition.
Most often Aluminum, but can also be copper. The most commonly used thickness is 0.040" (1.0mm) although many thicknesses are available.
Formable Thermal Printed Circuit Board Solutions:
A unique proposition is Formable Thermal LED PCB Solutions. Unlike brittle ceramic or epoxy systems, the dielectric is formulated using a flexible thermally loaded material. This allows component placement using standard paste and reflow techniques, the board is formed to shape after assembly giving a one piece system removing the need for interconnecting wires.
Thermal Clad Printed Circuit Board – Applications
Thermal clad offers a variety of thermal performances is compatible with mechanical fasteners and is highly reliable.
Using Thermal Clad PCB’s assures the lowest possible operating temperatures and maximum brightness, color and life.
Thermal Clad dielectric choices provide the electrical isolation needed to meet operating parameters and safety agency test requirements.
Solid State Relays:
Thermal clad offers a very thermally efficient and mechanically robust substrate.
The automotive industry uses Thermal clad boards as they need long term reliability under high operating temperatures coupled with their requirement of effective space utilization.
Improve the durability and performance of your product by using Thermal Clad PCB’s. Simple designs and low thermal impedance of the dielectric out performs all other PCB insulators for power and high-operating temperature components.
Thermal Clad PCB Material
Thermal Clad PCB Specifications
- 1 & 2 Layer Dielectrics
- Up to 5 oz finished Cu
- Al and CU base material up to .250" thick
- HASL, ENIG and Pb Free HASL finish available
Thermal Clad PCB Benefits
- Lower Operating Temperatures
- Improved Product Durability
- Increased Power Density
- Increased Thermal Efficiency
- Reduced Number of Interconnects
- Lower Junction Temperatures
- Reduced PCB Size
- Eliminates Older Hardware
- Minimizes Labor Required for Assembly
- Wide Variety of Form Factors
- Minimize Thermal Impedance