PCB Manufacturing Process Capabilities


Category Description Sym. Capability
1. Microvia Diameter
PCB Manufacturing Process Capabilities - Microvia Diameter
1.1
Microvia Diameter at Target Land
A 100 um
0.004"
1.2
Microvia Diameter at Capture Land
B 125 um
0.005"
1.3
Microvia Target Land Size
C 0.012"
1.4
Microvia Target Land Size
D 450 um
0.0177"
2. Stagger & Stack
PCB Manufacturing Process Capabilities - Stagger and Stack
2.1
Min. Staggered Via Pitch Staggered Via Pitch
A 560 um
0.022"
2.2
RCC Thickness
RCC
B 50 um
0.002"
2.3
Blind Via Layers
N 2
3. Material & Construction
PCB Manufacturing Process Capabilities - Material and Construction
3.1
Finished Board Thickness
H 0.012" – 0.250"
3.2
Min. Inner Layer Thickness
H1 0.075 mm
0.003"
3.3
Min. Dielectric Thickness
H2 0.05 mm
0.002"
3.4
Max. Inner Layer Copper
T1 10 oz
3.5
Max. Outer Layer Copper
T2 6 oz
4. Warp
PCB Manufacturing Process Capabilities - Warp
4.1
Warp & Twist (Max.)
A B < 0.75%
5. Pad
PCB Manufacturing Process Capabilities - Pad
5.1
Min. Finish Hole Size
H 0.005"
5.2
Min. Land Size
H 0.018"
5.3
Min. Annual Ring for Via
R1 IPC Class 2
5.4
Min. Annual Ring for Component
R1 0.05 mm
0.002", provided designed per IPC
6. Drill
PCB Manufacturing Process Capabilities - Drill
6.1
Tolerance for PTH Hole
A 0.08 mm
0.003"
6.2
NPTH Hole Tolerance
B 0.05 mm
0.002"
7. Registration for S/M
PCB Manufacturing Process Capabilities - Registration for S/M
7.1
Registration for S/M to Pattern
S1-S2 0.0024"
7.2
Registration for Legend to S/M
NA 0.005"
8. Registration for Drill
PCB Manufacturing Process Capabilities - Registration for Drill
8.1
Registration for Drill to Inner Layer
S 0.075 mm
0.003"
8.2
Registration for Drill to Datum
S 0.05 mm
0.002"
8.3
Registration for First Drill to Second Drill
NA 0.005"
9. Registration for Layers
PCB Manufacturing Process Capabilities - Registration for Layers
9.1
Layer to Layer for 4 layers
S 0.08 mm
0.003"
9.2
Layer to Layer for 6 layers
S 0.10 mm
0.004"
9.3
Layer to Layer for 8 layers
S 0.13 mm
0.005"
10. Line Width
PCB Manufacturing Process Capabilities - Line Width
10.1
I/L Min. Width (0.5 oz)
W2 0.003"
10.2
O/L Min. Width (0.5 oz)
W1 0.003"
11. Line Space
PCB Manufacturing Process Capabilities - Line Space
11.1
I/L Min. Space
S2 0.003"
11.2
O/L Min. Space (0.5 oz)
S 0.003"
12. Drill Capability
PCB Manufacturing Process Capabilities - Drill Capability
12.1
Max. Aspect Ratio
(Board Thickness 0.063")
H/T 12.0
12.2
Min. Drill Hole Size
(Board Thickness 0.063",After Plating)
H 0.0083
13. S/M Thickness
PCB Manufacturing Process Capabilities - S/M Thickness
13.1
Max. Thickness on Copper
H1 0.025 mm
0.001"
13.2
Max. Thickness at Shoulder
H2 0.0075 mm
0.0003"
14. S/M Capability
PCB Manufacturing Process Capabilities - S/M Capability
14.1
Min. SMD Space for Dam
W2 0.0078"
14.2
Min. Dam Size
W1 0.0003"
15. Carbon Capability
PCB Manufacturing Process Capabilities - Carbon Capability
15.1
Max. Contact Resistance
NA 30 Ω / sq
15.2
Max. Primary Resistance
NA 30 Ω
15.3
Min. Thickness
NA 0.0004"
15.4
Min. Space
A 0.015"
15.5
Max. Space for Registration
B 0.007"
16. HAL Capability
PCB Manufacturing Process Capabilities - HAL Capability
16.1
Min. PCB Thickness for HAL
H2 0.6 mm
0.0236"
16.2
Min. Pad Width/Space for HAL
W 0.25 mm
0.0098"
16.3
HAL Thickness for any point
H1 0.001 mm ~
0.025 mm
40micro-inch ~0.001"
16.4
Thickness on QFP Pad
(0.05" Wide Quad)
A 0.015 mm ~
0.030 mm
0.0006”~0.0012"
17. HAL Capability
PCB Manufacturing Process Capabilities - HAL Capability
17.1
Outline Tolerance-Punching
AB NA
17.2
Outline Tolerance-Routing
AB 0.005"
18. Beveling Capability
PCB Manufacturing Process Capabilities - Beveling Capability
18.1
Beveling Angle
B 200-600
18.2
Tolerance for Outline of Bevel
A + - 0.005"
19. V-Cut Capability
PCB Manufacturing Process Capabilities - V-Cut Capability
19.1
V-Cut Angle V-Cut
C 30°
19.2
Range of Board Thickness
H 0.030"~0.125"
19.3
Tolerance of V-Cut Residual
B 0.05 mm
0.003"
19.4
V-Cut Off Line V-Cut
D 0.125 mm
0.005"
20. Test Capability
PCB Manufacturing Process Capabilities - Test Capability
20.1
Voltage
NA 5 –500 VDC
20.2
Isolation
NA 500 MΩ
20.3
Continuity
NA 20Ω~100KΩ
20.4
Min. SMD PAD Pitch SMD
P 0.3 mm
0.0118"
21. Impedance Control Capability
PCB Manufacturing Process Capabilities - Impedance Control Capability
21.1
Impedance Control > 50O
NA +/- 10%
21.2
Impedance Control < 50O
NA +/- 10%
22. Differential Impedance Capability
PCB Manufacturing Process Capabilities - Differential Impedance Capability
22.1
Differential Impedance Control > 50O
NA +/- 10%
22.2
Differential Impedance Control < 50O
NA +/- 10%
23. Coplanar Impedance Capability
PCB Manufacturing Process Capabilities - Coplanar Impedance Capability
22.1
Coplanar Impedance Control > 50O
NA +/- 10%
22.2
Coplanar Impedance Control < 50O
NA +/- 10%
Celebrating 65 Years of Manufacturing Excellence  Learn More →
America's Oldest. A History of Innovation.

Today at Epec, the customer comes first, and everything we do must be put through that filter. Whether it is developing e-commerce platforms to make it easier to work with us, or creating a NPI (new product introduction) process that helps our customers get to market faster, or the other 10 new projects we have in process, we must focus on building the new. By doing that every day, and by always making the customer our top priority, we plan on being here for another 65 years and then some.

Learn more about our 65 year story →



Celebrating 65 Years - Epec Engineered Technologies