PCB Manufacturing Process Capabilities


Category Description Sym. Capability
1. Microvia Diameter
PCB Manufacturing Process Capabilities - Microvia Diameter
1.1
Microvia Diameter at Target Land
A 100 um
0.004"
1.2
Microvia Diameter at Capture Land
B 125 um
0.005"
1.3
Microvia Target Land Size
C 0.012"
1.4
Microvia Target Land Size
D 450 um
0.0177"
2. Stagger & Stack
PCB Manufacturing Process Capabilities - Stagger and Stack
2.1
Min. Staggered Via Pitch Staggered Via Pitch
A 560 um
0.022"
2.2
RCC Thickness
RCC
B 50 um
0.002"
2.3
Blind Via Layers
N 2
3. Material & Construction
PCB Manufacturing Process Capabilities - Material and Construction
3.1
Finished Board Thickness
H 0.012" – 0.250"
3.2
Min. Inner Layer Thickness
H1 0.075 mm
0.003"
3.3
Min. Dielectric Thickness
H2 0.05 mm
0.002"
3.4
Max. Inner Layer Copper
T1 10 oz
3.5
Max. Outer Layer Copper
T2 6 oz
4. Warp
PCB Manufacturing Process Capabilities - Warp
4.1
Warp & Twist (Max.)
A B < 0.75%
5. Pad
PCB Manufacturing Process Capabilities - Pad
5.1
Min. Finish Hole Size
H 0.005"
5.2
Min. Land Size
H 0.018"
5.3
Min. Annual Ring for Via
R1 IPC Class 2
5.4
Min. Annual Ring for Component
R1 0.05 mm
0.002", provided designed per IPC
6. Drill
PCB Manufacturing Process Capabilities - Drill
6.1
Tolerance for PTH Hole
A 0.08 mm
0.003"
6.2
NPTH Hole Tolerance
B 0.05 mm
0.002"
7. Registration for S/M
PCB Manufacturing Process Capabilities - Registration for S/M
7.1
Registration for S/M to Pattern
S1-S2 0.0024"
7.2
Registration for Legend to S/M
NA 0.005"
8. Registration for Drill
PCB Manufacturing Process Capabilities - Registration for Drill
8.1
Registration for Drill to Inner Layer
S 0.075 mm
0.003"
8.2
Registration for Drill to Datum
S 0.05 mm
0.002"
8.3
Registration for First Drill to Second Drill
NA 0.005"
9. Registration for Layers
PCB Manufacturing Process Capabilities - Registration for Layers
9.1
Layer to Layer for 4 layers
S 0.08 mm
0.003"
9.2
Layer to Layer for 6 layers
S 0.10 mm
0.004"
9.3
Layer to Layer for 8 layers
S 0.13 mm
0.005"
10. Line Width
PCB Manufacturing Process Capabilities - Line Width
10.1
I/L Min. Width (0.5 oz)
W2 0.003"
10.2
O/L Min. Width (0.5 oz)
W1 0.003"
11. Line Space
PCB Manufacturing Process Capabilities - Line Space
11.1
I/L Min. Space
S2 0.003"
11.2
O/L Min. Space (0.5 oz)
S 0.003"
12. Drill Capability
PCB Manufacturing Process Capabilities - Drill Capability
12.1
Max. Aspect Ratio
(Board Thickness 0.063")
H/T 12.0
12.2
Min. Drill Hole Size
(Board Thickness 0.063",After Plating)
H 0.0083
13. S/M Thickness
PCB Manufacturing Process Capabilities - S/M Thickness
13.1
Max. Thickness on Copper
H1 0.025 mm
0.001"
13.2
Max. Thickness at Shoulder
H2 0.0075 mm
0.0003"
14. S/M Capability
PCB Manufacturing Process Capabilities - S/M Capability
14.1
Min. SMD Space for Dam
W2 0.0078"
14.2
Min. Dam Size
W1 0.0003"
15. Carbon Capability
PCB Manufacturing Process Capabilities - Carbon Capability
15.1
Max. Contact Resistance
NA 30 Ω / sq
15.2
Max. Primary Resistance
NA 30 Ω
15.3
Min. Thickness
NA 0.0004"
15.4
Min. Space
A 0.015"
15.5
Max. Space for Registration
B 0.007"
16. HAL Capability
PCB Manufacturing Process Capabilities - HAL Capability
16.1
Min. PCB Thickness for HAL
H2 0.6 mm
0.0236"
16.2
Min. Pad Width/Space for HAL
W 0.25 mm
0.0098"
16.3
HAL Thickness for any point
H1 0.001 mm ~
0.025 mm
40micro-inch ~0.001"
16.4
Thickness on QFP Pad
(0.05" Wide Quad)
A 0.015 mm ~
0.030 mm
0.0006”~0.0012"
17. HAL Capability
PCB Manufacturing Process Capabilities - HAL Capability
17.1
Outline Tolerance-Punching
AB NA
17.2
Outline Tolerance-Routing
AB 0.005"
18. Beveling Capability
PCB Manufacturing Process Capabilities - Beveling Capability
18.1
Beveling Angle
B 200-600
18.2
Tolerance for Outline of Bevel
A + - 0.005"
19. V-Cut Capability
PCB Manufacturing Process Capabilities - V-Cut Capability
19.1
V-Cut Angle V-Cut
C 30°
19.2
Range of Board Thickness
H 0.030"~0.125"
19.3
Tolerance of V-Cut Residual
B 0.05 mm
0.003"
19.4
V-Cut Off Line V-Cut
D 0.125 mm
0.005"
20. Test Capability
PCB Manufacturing Process Capabilities - Test Capability
20.1
Voltage
NA 5 –500 VDC
20.2
Isolation
NA 500 MΩ
20.3
Continuity
NA 20Ω~100KΩ
20.4
Min. SMD PAD Pitch SMD
P 0.3 mm
0.0118"
21. Impedance Control Capability
PCB Manufacturing Process Capabilities - Impedance Control Capability
21.1
Impedance Control > 50O
NA +/- 10%
21.2
Impedance Control < 50O
NA +/- 10%
22. Differential Impedance Capability
PCB Manufacturing Process Capabilities - Differential Impedance Capability
22.1
Differential Impedance Control > 50O
NA +/- 10%
22.2
Differential Impedance Control < 50O
NA +/- 10%
23. Coplanar Impedance Capability
PCB Manufacturing Process Capabilities - Coplanar Impedance Capability
22.1
Coplanar Impedance Control > 50O
NA +/- 10%
22.2
Coplanar Impedance Control < 50O
NA +/- 10%
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Our History

As the oldest production Printed Circuit Board Company in North America, perhaps in the world, the 60-year plus story of Epec is connected to the development of the PCB and the electronics industry.

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  • Epec Founded in 1952
  • IPC Founded in 1957
  • Epec Builds PCB for Apollo 11