Circuit Boards Specifications

  Standard Advanced
Annular Ring
Internal Minimum Pad Size .014" larger than finished hole size .012" larger than finished hole size w/tear drop. Half-ounce ONLY
External Minimum Pad Size .014" larger than finished hole size .014" larger than finished hole size w/tear drop. Half-ounce ONLY
Increase pad size accordingly for annular ring requirements greater than .001"
Holes requiring greater than .001" copper (i.e. 2oz Base plated to 4oz Finish) require and additional .004 pad diameter.
Plane Layer Clearance
PTH & NPTH Hole Clearance to Plane .030" larger than finished hole size .020" larger than finished hole size
(.10" per side over FHS)
PTH & NPTH Hole to Inner Layer Trace .015" Spacing .010" Spacing (edge-to-edge)
Line Width and Space
Inner Layer Line width on H ounce copper Minimum -.004" Minimum - .004"
Inner Layer Line width on 1 ounce copper Standard-.005" Minimum-.004" Half-ounce ONLY
Inner Layer Line width on 2 ounce copper Minimum -.008" Minimum -.008"
Inner Layer Line width on 3 ounce base copper or greater Minimum -.012" Minimum -.012"
Outer Layer Line width on H ounce base copper Minimum-.004" Minimum-.004"
Outer Layer Line width on 1 ounce base copper Minimum -.005" Minimum - .004" Half-ounce ONLY
Outer Layer Line width on 2 ounce copper Minimum -.008" Minimum -.008"
Outer Layer Line width on 3 ounce base copper or greater Minimum -.012" Minimum -.012"
Inner layer Feature to Feature on 1 ounce or less base copper Minimum -.005" Minimum - .004" Half-ounce ONLY
Inner layer Feature to Feature on 2 ounce Base Copper Minimum -.008" Minimum -.008"
Inner layer Feature to Feature on 3 ounce copper or greater Minimum -.012" Minimum -.012"
Outer layer Feature to Feature on 1 ounce or less base copper Minimum -.005" Minimum - .004" Half-ounce ONLY
Outer layer Feature to Feature on 2 ounce Base Copper Minimum -.008" Minimum -.008"
Outer layer Feature to Feature on 3 ounce copper or greater Minimum -.012" Minimum -.012"
Trace to Plane Spacing Minimum -.008" Minimum -.008"
Feature to Board Edge *does not include tabs Minimum -.010" Minimum -.008"
Feature to Score Edge Minimum -.020" Minimum -.015"
Solder Mask
LPI Conductor Overlap .015" Larger Than Feature Size .010" Larger Than Feature Size
LPI Mask Clearance .015" Minimum .013" Minimum
LPI Mask Web .005" Minimum .005" Minimum
Less than 4 mil web between component pins may result in loss of mask between SMT pads.   Decrease clearance to 5 mil, then web to 3.5mil, then clearance to 4 mil, etc.
Silkscreen
Silk Screen Ink .008" minimum aperture .006" minimum aperture
Copper Features (ETCHED TEXT) .010" minimum aperture .010" minimum aperture
Font Height .065" minimum height .045" minimum height

If the specifications of a board design fall into the advanced category it may be subject to additional charges.

Celebrating 65 Years of Manufacturing Excellence  Learn More →
America's Oldest. A History of Innovation.

Today at Epec, the customer comes first, and everything we do must be put through that filter. Whether it is developing e-commerce platforms to make it easier to work with us, or creating a NPI (new product introduction) process that helps our customers get to market faster, or the other 10 new projects we have in process, we must focus on building the new. By doing that every day, and by always making the customer our top priority, we plan on being here for another 65 years and then some.

Learn more about our 65 year story →



Celebrating 65 Years - Epec Engineered Technologies