Printed Circuit Board Reliability Test

Epec manufactured circuit boards go through a series of extensive tests and inspections at each step of the manufacturing process to assure the products we ship meets or exceed your specifications. Below are some of our circuit board test methods.


PCB Lamination

Test Item Test Method/Equipment Criteria Capability
Glass Transition

Temperature
D.S.C
T.M.A
D.M.A
FR- 4 Tetra>130°(D.S.C)
FR- 4 NP170>175°(D.M.A)
FR- 406>165°(D.S.C)
>132°
>176°
>168°
Peel Strength IPC-TM-650 Trace to Laminate>9 lb/in (Normal Tg Material)
Trace to Laminate 6 lb/in (High Tg Material)
Layer to Layer>4 lb/in
>10 lb
>6 lb
>6 lb


PCB Copper Plating

Test Item Test Method/Equipment Criteria Capability
Elongation Test TPC-TM-650 >6% >10%
Tensile Strength TPC-TM-650 >25kg/mm >30kgf


PCB Solderability

Test Item Test Method/Equipment Criteria Capability
PTH


SMD / BGA Pad
1. Solder Pot Floating:
245°,4sec

2. Wetting Balance
No Dewetting Pass


PCB Hole Wall Quality

Test Item Test Method/Equipment Criteria Capability
Temperature


Cycling
125°,15Min


-55°,15Min
1. Hole Wall Resistance <20%
change after 1000 cycles

2. Hole Wall Quality
1. <20


2. No Crack
Thermal


Shock
125°,5min


-55°,5min
1. Hole Wall Resistance<10%
change after 100 cycle

2. Hole wall Quality
1. <10%


2. No Crack
Thermal Stress 288°,10sec,
Solder Float
No Delamination
No Hole Wall Detect
Pass


PCB Electrical Test

Test Item Test Method/Equipment Criteria Capability
High Pot. Test 1000 Volts,1minute <1mA Leakage Pass


PCB Environment Test

Test Item Test Method/Equipment Criteria Capability
Water Absorption
Test (for BGA)
120°,2hrs,after 24hrs Wright Increase <0.24%
after 24hrs test
<0.2%


PCB Cleanliness Test

Test Item Test Method/Equipment Criteria Capability
Surface

Insulation

Resistance
Pre Condition:23°,
50% RH,3hr

Test Condition:35°,
85% RH,24hr
Insulation Resistance
After Black Oxide>10G Ω
After O/L Etch>10G Ω
After HASL>3G Ω
>10G Ω
>10G Ω
>4G Ω
Solvent

Extract

Conductivity
Omega Meter 600
SMD 15min

Omega Meter 500
SMD 15min (for BGA)

After Black Oxide,
O/L Etch, Finish Board
1. <6.4ugNacl/in²

2. <2.4ugNacl/in²
(for BGA substrate)
1. Avg:<4

2. Avg:<2.0
High Humidity 50°,95%/RH,
7days,100V Bias
Resistance>1G Ω Pass
I.C.T I.C.T 1. CI‾ <3ug/in²
2. Br‾ <3ug/in²
3. SO4²- <10ug/in²
1. Avg:<2.8
2. Avg:<2
3. Avg:<8
Celebrating 65 Years of Manufacturing Excellence  Learn More →
America's Oldest. A History of Innovation.

Today at Epec, the customer comes first, and everything we do must be put through that filter. Whether it is developing e-commerce platforms to make it easier to work with us, or creating a NPI (new product introduction) process that helps our customers get to market faster, or the other 10 new projects we have in process, we must focus on building the new. By doing that every day, and by always making the customer our top priority, we plan on being here for another 65 years and then some.

Learn more about our 65 year story →



Celebrating 65 Years - Epec Engineered Technologies