RoHS Compliance

Our Commitment to Environmental Responsibility

Epec is a leader in Printed Circuit Board solutions and is committed to taking an active role in working closely with our customers and suppliers to identify and rapidly eliminate hazardous substances from their products. As an ISO 9001:2000 registered company, Epec is fully supportive of electronics industry efforts throughout the world to phase out the use of lead and other undesirable elements.


Lead Free & RoHS Compliant Initiative

Epec is a leader in providing an extensive array of lead free printed circuit board solutions. Epec’s lead free products are fully RoHS compliant.


RoHS Restricted Materials

Banned Substance RoHS LIMIT: MCV* PPM
Lead (Pb) 1000
Mercury (Hg) 1000
Cadmium (Cd) 100
Hexavalent Chromium (Cr+6) 1000
Polybrominated Biphenyl (PBB) 1000
Polybrominated Diphenyl Ether (PBDE) 1000

* MCV - Maximum concentration values allowed in homogeneous materials



Halogen Free Materials

What are Halogen-free requirements?


  • Bromine must be below 900 PPM by weight
  • Chlorine must be below 900 PPM by weight
  • Combined Bromine + Chlorine must be below 1200 PPM by weight

Laminate


  • The TBPPA based fire retardant material must be replaced
  • We do offer Halogen-free materials

Soldermask


  • Most soldermasks contain chlorine
  • We do have a limited offering of halogen-free masks


RoHS Compliant Material Identification and Packaging

Epec provides a RoHS Certification of Conformance (C of C) with all shipments. To allow easy identification of all RoHS compliant products and materials, all our packaging has a RoHS/Pb-Free label.

RoHS Compliant Products



IPC-1752 RoHS Materials Declaration Standard

Compliance requires that Epec and our suppliers understand the material composition of our products—from FR4 laminate, solder mask, silkscreen, and plating, to surface finish and finished boards. We will provide you with technical documentation and supplier declarations to support your "due diligence." You are expected to provide this documentation upon request of EU regulators.



RoHS Compliant Surface Finish Options

Epec has qualified a wide variety of RoHS compliant surface finish alternatives.


These qualified finishes include:

Surface Finishes Shelf Life Coplanarity Multiple Rework
ENIG 12+ Months Yes Yes
Immersion Silver *6-9 Months Yes Limited
Lead Free HASL 12 Months Moderate Yes
OSP 6-12 Months Yes No
Immersion Tin 3 Months Yes Limited

*With proper packaging and storage conditions




Higher Lead-free Assembly Temperature

Reflow Temperature Profile Comparison



  • Low thermal mass assembly reflow @ 240 –245C
  • Higher thermal mass assembly reflow @ 260C
  • Lead-free PCB temperature is 30C higher than SnPb process
  • Up to 6 soldering/rework cycles may be required


Pb-Free Compatible FR4s

Pb-Free Compatible FR4s



For additional information visit Epec's RoHS FAQ page.