Flex Circuit Capabilities

Below are our flex and rigid flex circuit capabilities, along with available materials substrates and adhesives. We also offer an extensive range of solder mask and coverlay products as well as various surface and finishes treatments.


Our Flex Circuit Capabilities Include

  • Single or Double Sided Circuitry
  • Multi-layers, 2 to 6 FPC & Rigid-Flex
  • Lines and Spaces: Single Sided .002", Double Sided .003" - .004"
  • Installation of Connectors, Pins, Contacts, etc.
  • Assembly including SMD
  • Stiffener Supported Areas (using FR-4, Polyimide, Polyester, etc.)
  • Unsupported Fingers
  • Blind & Buried Vias
  • Controlled Impedance
  • Selective Adhesive
  • Shielding, solid or patterned
  • Forming & Creasing
  • Circuits up to 18" x 24"

Flex Circuit Materials

Substrates

  • Kapton: Polyimide 1/2 – 5 mils
  • Mylar: Polyester 2 - 5 mils
  • Epoxy
  • Teflon

Copper

  • Half Hard Electro-deposited

Adhesives

  • Modified Acrylic
  • Modified Epoxy
  • Pressure Sensitive (PSA)

Solder Mask / Coverlay

  • Kapton Coverlay 1/2 mil to 5 mils
  • Polyester Coverlay 1 mil to 3 mils
  • Photoimageable Coverlay
  • Soldermask

Surface Treatment & Finishes

  • Hard or Soft Gold
  • Hot Air Level (H.A.L.)
  • Carbon Printing
  • Screen Print Solder Mask
  • Silver
America's Oldest, A History of Innovation.  Learn More →
Our History

As the oldest production Printed Circuit Board Company in North America, perhaps in the world, the 60-year plus story of Epec is connected to the development of the PCB and the electronics industry.

From pioneering innovation in the PCB Industry with R & D, training and setting professional core values, the legacy of Epec has now passed to a new generation of very bright young people, but still continues the great tradition of imagination.

See our history timeline →



  • Epec Founded in 192
  • IPC Founded