Flex Circuit Capabilities


  • Single or Double Sided Circuitry
  • Multilayers, 2 to 6 FPC & Rigid-Flex
  • Lines and Spaces: Single Sided .002", Double Sided .003" - .004"
  • Installation of Connectors, Pins, Contacts, etc.
  • Assembly including SMD
  • Stiffener Supported Areas (using FR-4, Polyamide, Polyester, etc.)
  • Unsupported Fingers
  • Blind & Buried Vias
  • Controlled Impedance
  • Selective Adhesive
  • Shielding, solid or patterned
  • Forming & Creasing
  • Circuits up to 18" x 24"

Materials


Substrates

  • Kapton: Polyimide 1/2 – 5 mils
  • Mylar: Polyester 2 - 5 mils
  • Epoxy
  • Teflon

Copper

  • Half Hard Electro-deposited

Adhesives

  • Modified Acrylic
  • Modified Epoxy
  • Pressure Sensitive (PSA)

Solder Mask / Coverlay


  • Kapton Coverlay 1/2 mil to 5 mils
  • Polyester Coverlay 1 mil to 3 mils
  • Photoimageable Coverlay
  • Soldermask

Surface Treatment & Finishes


  • Hard or Soft Gold
  • Hot Air Level (H.A.L.)
  • Carbon Printing
  • Screen Print Solder Mask
  • Silver

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