Flex Circuit Material Properties


Typical Properties of Dielectric Material for Flexible Printed Circuitry

Property (Typical) Units Polymide Polymide (Adhesiveless) Polyester
Representative Trade Name   KAPTON KAPTON MYLAR
Physical
Thickness Range mil 0.5 to 5 1-6 2-5
Tensile Strength (@25°C) psi 25,000 50,000 20,000 to 35,000
Break Elongation % 70 50 60 to 165
Tensile Modulus (@25°C) 100,000 psi 4.3 .7 5
Tear Initiation Strength lb/in 1000 700-1200 1000 to 1500
Tear Propagation Strength g/mil 8 20 12 to 25
Chemical
Resistance to:        
Strong Acids   Good Good Good
Strong Alkalis   Poor Good Poor
Grease and Oil   Good Good Good
Organic Solvents   Good Good Good
Water   Good Good Good
Sunlight   Good Good Fair
Fungus   Non-nutrient Non-nutrient Non-nutrient
Water Absorption % (24 hours) 2.9 0.8 <0.8
Thermal
Service Temperature (min/max) degree C -125/+200 -125/+200 -60/+105
Coefficient of Thermal Expansion (@22°C) PPM/degree C 20 20 27
Change in Linear Dimensions (100°C, 30min) % <0.3 0.04-0.02 <0.5
Electrical
Dielectric Constant (ASTM D150) 1MHz   3.4 3.4 3
Dissipation Factor (ASTM D150) 1MHz   0.01 0.003 0.018
Dielectric Strength (ASTM D149)
@ 1 mil thickness
Volume Resistivity (ASTM D257)
V/mil
ohm-cm
6000
1.0E+16
6000
1.0E+16
3400
1.0E+16
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As the oldest production Printed Circuit Board Company in North America, perhaps in the world, the 60-year plus story of Epec is connected to the development of the PCB and the electronics industry.

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  • Epec Founded in 1952
  • IPC Founded in 1957
  • Epec Builds PCB for Apollo 11