What causes pad lifting on printed circuit boards?
If the pads are not sitting correctly or are lifted, it can cause the connection between the PCB and the component to fail.
Common PCB Fabrication Problems: Plating Voids
Plating voids in plated through holes happen when, during the deposition process, copper is not coated evenly, preventing proper plating.
Surface Finishes: Why do I need to know more?
The printed circuit board surface finish forms a critical interface between the component to be assembled and the bare PCB.
Download our Surface Finishes Presentation →
Wave Soldering Defects
Wave soldering is a large-scale soldering process by which electronic components are soldered to a printed circuit board (PCB) to form an electronic assembly.
Controlled Impedance: Why do I need to know more?
Every circuit on a PCB has impedance. The goal is to control the impedance.
Download our Controlled Impedance Presentation →
Epec's recommended V-Cut
Below is a diagram which describes the recommended dimensions for V-Cut.
See our blog post on v-scoring of printed circuit boards in arrays for more information.
The following document was designed to answer some of the more common questions surrounding RoHS. However, if, after reading, you still have questions, please contact one of the knowledgeable members of our Engineering Team.
Minimum PCB Data/Information Requirements to Place Order
The purpose of this document is to describe the minimum data and information required by Epec Engineering to generate the tooling.
Read more about our PCB Data Requirements →
Staining of Solder Mask
Learn some of the issues surrounding Solder Mask Staining as well as some of the causes and remedies.
Click below to view pictures of this particular board defect:
Learn more about Solder Mask Design Basics →