Printed Circuit Board Reliability Test
Epec manufactured circuit boards go through a sereis of extensive tests and inspections at each step of the manufacturing process to assure the products we ship meets or exceed your specifications. Below are some of our circuit board test methods.
| Printed Circuit Board Lamination | |||
| Test Item | Test Method/Equipment | Criteria | Capability |
| Glass Transition Temperature |
D.S.C T.M.A D.M.A |
FR- 4 Tetra>130°(D.S.C) FR- 4 NP170>175°(D.M.A) FR- 406>165°(D.S.C) |
>132° >176° >168° |
| Peel Strength | IPC-TM-650 | Trace to Laminate>9 lb/in (Normal Tg Material) Trace to Laminate 6 lb/in (High Tg Material) Layer to Layer>4 lb/in |
>10 lb >6 lb >6 lb |
| Printed Circuit Board Copper Plating | |||
| Test Item | Test Method/Equipment | Criteria | Capability |
| Elongation Test | TPC-TM-650 | >6% | >10% |
| Tensile Strength | TPC-TM-650 | >25kg/mm | >30kgf |
| Printed Circuit Board Solderability | |||
| Test Item | Test Method/Equipment | Criteria | Capability |
| PTH SMD / BGA Pad |
1. Solder Pot Floating: 245°,4sec 2. Wetting Balance |
No Dewetting | Pass |
| Printed Circuit Board Hole Wall Quality | |||
| Test Item | Test Method/Equipment | Criteria | Capability |
| Temperature Cycling |
125°,15Min -55°,15Min |
1. Hole Wall Resistance <20% change after 1000 cycles 2. Hole Wall Quality |
1. <20 2. No Crack |
| Thermal Shock |
125°,5min -55°,5min |
1. Hole Wall Resistance<10% change after 100 cycle 2. Hole wall Quality |
1. <10% 2. No Crack |
| Thermal Stress | 288°,10sec, Solder Float |
No Delamination No Hole Wall Detect |
Pass |
| Electrical | |||
| Test Item | Test Method/Equipment | Criteria | Capability |
| High Pot. Test | 1000 Volts,1minute | <1mA Leakage | Pass |
| Environment | |||
| Test Item | Test Method/Equipment | Criteria | Capability |
| Water Absorption Test (for BGA) |
120°,2hrs,after 24hrs | Wright Increase <0.24% after 24hrs test |
<0.2% |
| Cleanliness | |||
| Test Item | Test Method/Equipment | Criteria | Capability |
| Surface Insulation Resistance |
Pre Condition:23°, 50% RH,3hr Test Condition:35°, 85% RH,24hr |
Insulation Resistance After Black Oxide>10G Ω After O/L Etch>10G Ω After HASL>3G Ω |
>10G Ω >10G Ω >4G Ω |
| Solvent Extract Conductivity |
Omega Meter 600 SMD 15min Omega Meter 500 SMD 15min (for BGA) After Black Oxide, O/L Etch, Finish Board |
1. <6.4ugNacl/in² 2. <2.4ugNacl/in² (for BGA substrate) |
1. Avg:<4 2. Avg:<2.0 |
| High Humidity | 50°,95%/RH, 7days,100V Bias |
Resistance>1G Ω | Pass |
| I.C.T | I.C.T | 1. CI‾ <3ug/in² 2. Br‾ <3ug/in² 3. SO4²- <10ug/in² |
1. Avg:<2.8 2. Avg:<2 3. Avg:<8 |
