Reliability Test

Lamination
Test Item Test Method/Equipment Criteria Capability
Glass Transition

Temperature
D.S.C
T.M.A
D.M.A
FR- 4 Tetra>130°(D.S.C)
FR- 4 NP170>175°(D.M.A)
FR- 406>165°(D.S.C)
>132°
>176°
>168°
Peel Strength IPC-TM-650 Trace to Laminate>9 lb/in (Normal Tg Material)
Trace to Laminate 6 lb/in (High Tg Material)
Layer to Layer>4 lb/in
>10 lb
>6 lb
>6 lb

Copper Plating
Test Item Test Method/Equipment Criteria Capability
Elongation Test TPC-TM-650 >6% >10%
Tensile Strength TPC-TM-650 >25kg/mm >30kgf

Solderability
Test Item Test Method/Equipment Criteria Capability
PTH


SMD / BGA Pad
1. Solder Pot Floating:
245°,4sec

2. Wetting Balance
No Dewetting Pass

Hole Wall Quality
Test Item Test Method/Equipment Criteria Capability
Temperature


Cycling
125°,15Min


-55°,15Min
1. Hole Wall Resistance <20%
change after 1000 cycles

2. Hole Wall Quality
1. <20


2. No Crack
Thermal


Shock
125°,5min


-55°,5min
1. Hole Wall Resistance<10%
change after 100 cycle

2. Hole wall Quality
1. <10%


2. No Crack
Thermal Stress 288°,10sec,
Solder Float
No Delamination
No Hole Wall Detect
Pass

Electrical
Test Item Test Method/Equipment Criteria Capability
High Pot. Test 1000 Volts,1minute <1mA Leakage Pass

Environment
Test Item Test Method/Equipment Criteria Capability
Water Absorption
Test (for BGA)
120°,2hrs,after 24hrs Wright Increase <0.24%
after 24hrs test
<0.2%

Cleanliness
Test Item Test Method/Equipment Criteria Capability
Surface

Insulation

Resistance
Pre Condition:23°,
50% RH,3hr

Test Condition:35°,
85% RH,24hr
Insulation Resistance
After Black Oxide>10G Ω
After O/L Etch>10G Ω
After HASL>3G Ω
>10G Ω
>10G Ω
>4G Ω
Solvent

Extract

Conductivity
Omega Meter 600
SMD 15min

Omega Meter 500
SMD 15min (for BGA)

After Black Oxide,
O/L Etch, Finish Board
1. <6.4ugNacl/in²

2. <2.4ugNacl/in²
(for BGA substrate)
1. Avg:<4

2. Avg:<2.0
High Humidity 50°,95%/RH,
7days,100V Bias
Resistance>1G Ω Pass
I.C.T I.C.T 1. CI‾ <3ug/in²
2. Br‾ <3ug/in²
3. SO4²- <10ug/in²
1. Avg:<2.8
2. Avg:<2
3. Avg:<8