Reliability Test
| Lamination | |||
| Test Item | Test Method/Equipment | Criteria | Capability |
| Glass Transition Temperature |
D.S.C T.M.A D.M.A |
FR- 4 Tetra>130°(D.S.C) FR- 4 NP170>175°(D.M.A) FR- 406>165°(D.S.C) |
>132° >176° >168° |
| Peel Strength | IPC-TM-650 | Trace to Laminate>9 lb/in (Normal Tg Material) Trace to Laminate 6 lb/in (High Tg Material) Layer to Layer>4 lb/in |
>10 lb >6 lb >6 lb |
| Copper Plating | |||
| Test Item | Test Method/Equipment | Criteria | Capability |
| Elongation Test | TPC-TM-650 | >6% | >10% |
| Tensile Strength | TPC-TM-650 | >25kg/mm | >30kgf |
| Solderability | |||
| Test Item | Test Method/Equipment | Criteria | Capability |
| PTH SMD / BGA Pad |
1. Solder Pot Floating: 245°,4sec 2. Wetting Balance |
No Dewetting | Pass |
| Hole Wall Quality | |||
| Test Item | Test Method/Equipment | Criteria | Capability |
| Temperature Cycling |
125°,15Min -55°,15Min |
1. Hole Wall Resistance <20% change after 1000 cycles 2. Hole Wall Quality |
1. <20 2. No Crack |
| Thermal Shock |
125°,5min -55°,5min |
1. Hole Wall Resistance<10% change after 100 cycle 2. Hole wall Quality |
1. <10% 2. No Crack |
| Thermal Stress | 288°,10sec, Solder Float |
No Delamination No Hole Wall Detect |
Pass |
| Electrical | |||
| Test Item | Test Method/Equipment | Criteria | Capability |
| High Pot. Test | 1000 Volts,1minute | <1mA Leakage | Pass |
| Environment | |||
| Test Item | Test Method/Equipment | Criteria | Capability |
| Water Absorption Test (for BGA) |
120°,2hrs,after 24hrs | Wright Increase <0.24% after 24hrs test |
<0.2% |
| Cleanliness | |||
| Test Item | Test Method/Equipment | Criteria | Capability |
| Surface Insulation Resistance |
Pre Condition:23°, 50% RH,3hr Test Condition:35°, 85% RH,24hr |
Insulation Resistance After Black Oxide>10G Ω After O/L Etch>10G Ω After HASL>3G Ω |
>10G Ω >10G Ω >4G Ω |
| Solvent Extract Conductivity |
Omega Meter 600 SMD 15min Omega Meter 500 SMD 15min (for BGA) After Black Oxide, O/L Etch, Finish Board |
1. <6.4ugNacl/in² 2. <2.4ugNacl/in² (for BGA substrate) |
1. Avg:<4 2. Avg:<2.0 |
| High Humidity | 50°,95%/RH, 7days,100V Bias |
Resistance>1G Ω | Pass |
| I.C.T | I.C.T | 1. CI‾ <3ug/in² 2. Br‾ <3ug/in² 3. SO4²- <10ug/in² |
1. Avg:<2.8 2. Avg:<2 3. Avg:<8 |