PCB Manufacturing Process
Below are some images from the printed circuit board manufacturing process. Including, drill, plating, and final fabrication. All our circuit boards go through intensive testing and quality control during each step of the manufacturing process.
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Inner LayerInner layer core shown after etch\dryfilm strip processes have been completed. The core is now ready for post etch punch. -
Laser DrillLaser drill is necessary for today growing technolgy, drilling the smallest micro-vias using a beam of light 20 microns (1 Mil) in diameter. High influence beams can cut thru metal and glass creating the tiny via hole. -
Post Etch PunchPunching core material is the only acceptable method of building precision tooling which must remain accurate in a production atmosphere. -
Press RoomPress lines for manufacturing quality, high layer count PCB's with consistency and in a timely manner. -
DrillCNC machines are complete with drill and profile routing software allowing for high performance and throughput. -
PlatingAutomated plating lines serving quick turns and production of small to high volume. -
Strip - Etch - Strip LineProduction panels proceed to etching to remove unwanted copper and into the strip line to remove protective film. -
Automated Optical Inspection (AOI)Using the latest in optical inspection equipment on internal and external layers allows for minimal fallout on final product. -
Final Fabrication (Routing & Scoring)Routing and scoring to precise dimensions within supplied tolerances are the final steps prior to electrical testing. Constant monitoring by engineering ensures parts will meet your specifications. -
Electrical TestFlying Probe testers are used to 100% electrical test all PCB's on site at manufacturing.
