PCB Manufacturing Process Capabilities

Category	Description	Sym.	Capability
1. Microvia Diameter	1.1 Microvia Diameter at Target Land	A	100 um 0.004"
	1.2 Microvia Diameter at Capture Land	B	125 um 0.005"
	1.3 Microvia Target Land Size	C	0.012"
	1.4 Microvia Target Land Size	D	450 um 0.0177"
2. Stagger & Stack	2.1 Min. Staggered Via Pitch Staggered Via Pitch	A	560 um 0.022"
	2.2 RCC Thickness RCC	B	50 um 0.002"
	2.3 Blind Via Layers	N	2
3. Material & Construction	3.1 Finished Board Thickness	H	0.012" – 0.250"
	3.2 Min. Inner Layer Thickness	H1	0.075 mm 0.003"
	3.3 Min. Dielectric Thickness	H2	0.05 mm 0.002"
	3.4 Max. Inner Layer Copper	T1	10 oz
	3.5 Max. Outer Layer Copper	T2	6 oz
4. Warp	4.1 Warp & Twist (Max.)	A B	< 0.75%
5. Pad	5.1 Min. Finish Hole Size	H	0.005"
	5.2 Min. Land Size	H	0.018"
	5.3 Min. Annual Ring for Via	R1	IPC Class 2
	5.4 Min. Annual Ring for Component	R1	0.05 mm 0.002", provided designed per IPC
6. Drill	6.1 Tolerance for PTH Hole	A	0.08 mm 0.003"
6. Drill	6.2 NPTH Hole Tolerance	B	0.05 mm 0.002"
7. Registration for S/M	7.1 Registration for S/M to Pattern	S1-S2	0.0024"
7. Registration for S/M	7.2 Registration for Legend to S/M	NA	0.005"
8. Registration for Drill	8.1 Registration for Drill to Inner Layer	S	0.075 mm 0.003"
	8.2 Registration for Drill to Datum	S	0.05 mm 0.002"
	8.3 Registration for First Drill to Second Drill	NA	0.005"
9. Registration for Layers	9.1 Layer to Layer for 4 layers	S	0.08 mm 0.003"
	9.2 Layer to Layer for 6 layers	S	0.10 mm 0.004"
	9.3 Layer to Layer for 8 layers	S	0.13 mm 0.005"
10. Line Width	10.1 I/L Min. Width (0.5 oz)	W2	0.003"
10. Line Width	10.2 O/L Min. Width (0.5 oz)	W1	0.003"
11. Line Space	11.1 I/L Min. Space	S2	0.003"
11. Line Space	11.2 O/L Min. Space (0.5 oz)	S	0.003"
12. Drill Capability	12.1 Max. Aspect Ratio (Board Thickness 0.063")	H/T	12.0
12. Drill Capability	12.2 Min. Drill Hole Size (Board Thickness 0.063",After Plating)	H	0.0083

Category	Description	Sym.	Capability
13. S/M Thickness	13.1 Max. Thickness on Copper	H1	0.025 mm 0.001"
13. S/M Thickness	13.2 Max. Thickness at Shoulder	H2	0.0075 mm 0.0003"
14. S/M Capability	14.1 Min. SMD Space for Dam	W2	0.0078"
14. S/M Capability	14.2 Min. Dam Size	W1	0.0003"
15. Carbon Capability	15.1 Max. Contact Resistance	NA	30 O / sq
	15.2 Max. Primary Resistance	NA	30 O
	15.3 Min. Thickness	NA	0.0004"
	15.4 Min. Space	A	0.015"
	15.5 Max. Space for Registration	B	0.007"
16. HAL Capability	16.1 Board Thickness for HAL	H2	0.6 mm 0.0236"
	16.2 Min. Pad Width/Space fo HAL	W	0.25 mm 0.0098"
	16.3 HAL Thickness for any point	H1	0.001 mm ~ 0.025 mm 40micro-inch ~0.001"
	16.4 Thickness on QFP Pad (0.05" Wide Quad)	A	0.015 mm ~ 0.030 mm 0.0006”~0.0012"
17. HAL Capability	17.1 Outline Tolerance-Punching	AB	NA
17. HAL Capability	17.2 Outline Tolerance-Routing	AB	0.005"
18. Beveling Capability	18.1 Beveling Angle	B	200-600
18. Beveling Capability	18.2 Tolerance for Outline of Bevel	A	+ - 0.005"
19. V-Cut Capability	19.1 V-Cut Angle V-Cut	C	300
	19.2 Range of Board Thickness	H	0.010"~0.125"
	19.3 Tolerance of V-Cut Residual	B	0.05 mm 0.002"
	19.4 V-Cut Off Line V-Cut	D	0.125 mm 0.005"
20. Test Capability	20.1 Voltage	NA	5 –500 VDC
	20.2 Isolation	NA	500 MO
	20.3 Continuity	NA	20O~100KO
	20.4 Min. SMD PAD Pitch SMD	P	0.3 mm 0.0118"
21. Impedance Control Capability	21.1 Impedance Control > 50O	NA	+/- 10%
21. Impedance Control Capability	21.2 Impedance Control < 50O	NA	+/- 10%
22. Differential Impedance Capability	22.1 Differential Impedance Control > 50O	NA	+/- 10%
22. Differential Impedance Capability	22.2 Differential Impedance Control < 50O	NA	+/- 10%
23. Coplanar Impedance Capability	22.1 Coplanar Impedance Control > 50O	NA	+/- 10%
23. Coplanar Impedance Capability	22.2 Coplanar Impedance Control < 50O	NA	+/- 10%

PCB Manufacturing Process Capabilities

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