Battery Potting & Encapsulation

By utilizing potting and encapsulation compounds in your battery pack design, we can optimize the performance of your end product.

There are five basic types of resins used in this process; these materials are epoxy, urethane, silicone, acrylic and polyester. These polymeric formulations have excellent adhesion, thermal stability and outstanding chemical resistance.

These compounds are used to provide mechanical reinforcement to housed assemblies, to fill large voids, and to protect components from the exposure to chemicals, moisture, mechanical shock or vibration and can be accomplished either at atmospheric pressure or under vacuum pressure when voids within the resin are undesirable, a process called vacuum encapsulation.

Battery Potting and Encapsulation

Battery Potting

Potting is the process of partially or completely filling or embedding an enclosure with a compound for the purpose of providing resistance to shock and vibration, as well as creating a seal against moisture, solvents, and corrosive agents. Potting compounds are also used to aid with electrical insulation, flame retardency and heat dissipation.

The most common types of potting compounds are polyurethane, acrylic, epoxy resin, and silicone. These materials vary in hardness from very soft to hard and rigid, and are designed to withstand many different types of environments. Each of these chemistries does have its own strength and weaknesses though. Determining which compound is best for your application will be based on operating and environmental conditions, material physical properties, and processing needs.

Battery Pack Potting Process

Watch this short video to learn more about what is involved in the potting process of a custom battery pack.

Benefits of Potting:

  • Low cost shells
  • Hermetic like seal
  • Good electrical insulation
  • Can withstand environmental extremes
  • Many different materials with different cured properties

Battery Encapsulation

Encapsulation is a process similar to Potting. With encapsulation instead of filling a mold with a compound like during the potting process, the electronic assembly is impregnated inside the compound with the help of a reusable mold. Typically the reusable mold is made out of hard to adhere to materials such as Teflon or Silicone. The purpose of encapsulation is to create a protective “shell” around the battery assembly.

Encapsulation provides resistance to shock and vibration, as well as creating a seal against moisture, solvents, and corrosive agents. Encapsulation is also used to aid with electrical insulation, flame retardancy and heat dissipation.

Benefits of Encapsulation:

  • Low cost of reusable molds
  • Many different materials with varying cured properties
  • Good electrical insulation
  • Hermetic like seal
  • Good resistance to environmental extremes

Common Resin Manufacturers

  • Henkel
  • Lord
  • Masterbond
  • Locktite
  • Dow Corning
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Our History

As the oldest production Printed Circuit Board Company in North America, perhaps in the world, the 60-year plus story of Epec is connected to the development of the PCB and the electronics industry.

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  • Epec Founded in 1952
  • IPC Founded in 1957
  • Epec Builds PCB for Apollo 11